AMD's EPYC Venice To Outpace NVIDIA's Vera CPUs With 6.75M Units by 2027, Morgan Stanley Says, as Zen 6 Eclipses a 5.75M Rival
Key Points:
- NVIDIA is projected to remain TSMC's largest customer for CoWoS advanced packaging in 2027, with a 40% increase in CoWoS-L units for AI GPUs and a doubling of Vera CPU shipments, leading to an estimated 52% revenue growth year-over-year.
- AMD's next-generation EPYC Venice CPUs, based on the Zen 6 architecture and TSMC's 2nm process, are expected to outsell NVIDIA's Vera CPUs by 17% in 2027, reaching 6.75 million units compared to Vera's 5.75 million units.
- While NVIDIA's Vera CPUs focus on Agentic AI workloads, AMD's Venice targets both AI and high-performance computing (HPC), contributing to its higher projected shipment volume.
- The rise of custom silicon development by AI firms like OpenAI, Google, and Amazon poses a potential challenge to traditional chipmakers such as NVIDIA and AMD, as in-house chip production may increase supply-demand pressures in the semiconductor market.