AMD's Next-Gen Zen 7 "Grimlock" CPUs To Utilize TSMC 1.4nm Process Tech & FOPLP Packaging, Launching in 2028
Wccftech • • technology
Key Points:
- AMD's next-generation Zen 7 "Grimlock" CPUs are planned to utilize TSMC's advanced A14 1.4nm process technology, with mass production expected around 2028.
- The Zen 7 chips will feature a new core complex die (CCD) design with up to 16 cores and up to 224 MB of L3 cache, incorporating next-generation 3D V-Cache technology for enhanced performance.
- AMD is preparing its supply chain ahead of schedule and is exploring advanced packaging solutions, including Powertech's Fan-Out Panel-Level Packaging (FOPLP) technology.
- The Zen 7 architecture will also introduce updated MATRIX engine capabilities and expanded AI data format support, targeting significant growth in data center and AI workloads.
- This move positions AMD to compete aggressively in the evolving CPU market, especially amid increasing demand driven by AI and competition with Intel's foundry advancements.