Meta Partners With Broadcom to Co-Develop Custom AI Silicon

Key Points:

• Meta is expanding its partnership with Broadcom to co-develop multiple generations of its next-generation MTIA chips, custom silicon designed to power AI across Meta’s apps and services.
• The collaboration will focus on chip design, advanced packaging, and networking, leveraging Broadcom’s XPU platform and advanced Ethernet technologies to optimize Meta’s AI infrastructure and enable high-bandwidth networking for large AI compute clusters.
• Meta plans to develop and deploy four new generations of MTIA chips within the next two years to support ranking, recommendations, and generative AI workloads, starting with an initial commitment exceeding 1GW of custom silicon and scaling to multiple gigawatts over time.
• Broadcom CEO Hock Tan will transition from Meta’s Board of Directors to an advisor role, continuing to provide guidance on Meta’s custom silicon roadmap and infrastructure investments as the partnership grows.
• This expanded partnership and MTIA evolution are central to Meta’s AI infrastructure strategy, aimed at delivering personal superintelligence to billions of users globally with improved performance and efficiency.