Samsung’s RAM Shortage Struggles Claims Another Victim As Exynos 2700 To Witness One Trade-Off, Despite Being The Most Advanced 2nm SoC
Wccftech • • technology
Key Points:
- The Galaxy S27 lineup, expected in early 2027, may feature downgraded components due to Samsung's struggles with the ongoing DRAM crisis affecting the industry.
- The Exynos 2700 chip, powering some Galaxy S27 models, might omit Samsung’s advanced Fan-Out Wafer-Level Packaging (FOWLP), which was introduced with the Exynos 2400 to enhance performance and heat management.
- Removing FOWLP could lead to increased overheating and throttling issues, but Samsung may compensate by using side-by-side (SBS) architecture with heatsinks on both the processor and DRAM to manage temperatures.
- This potential performance compromise is seen as a necessary cost-cutting measure to keep the Galaxy S27 competitively priced amid rising RAM costs, though it may impact Samsung’s semiconductor business recovery.
- The rumor is rated as plausible (50%) based on reasonable evidence but lacks confirmation from Samsung.