Apple Could Unveil Its Sub-1nm Chips In A Few Years, As TSMC Said To Fire Up Trial Production In 2029
Key Points:
- TSMC plans to begin trial production of sub-1nm semiconductor technology by 2029, aiming for an initial monthly output of 5,000 wafers using facilities including its Tainan A10 and P1-P4 plants.
- The company is also targeting mass production of its 1.4nm process (A14) in 2028, which promises up to a 30% improvement in performance and power efficiency, alongside fulfilling orders for the 1.6nm node (A16).
- Apple is expected to be an early adopter of TSMC’s sub-1nm technology, likely integrating it into future products such as the iPhone 18’s A20 and A20 Pro chipsets launching later this year.
- High demand for AI chips and iPhone components is putting pressure on TSMC’s production capacity, potentially causing Apple to pay premiums for initial chip batches as in previous product cycles.
- Yield challenges with advanced nodes may force smartphone manufacturers to downgrade chipsets for some flagship models, reserving the latest SoCs for premium "Ultra" variants.