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Apple’s A20 Pro Front Side Die Shot Shows New Record For GPU Core Count To Deliver Better Graphics Performance, New Packaging Allows For Increased Memory Bus Width
Wccftech • • technology
Key Points:
- Apple’s upcoming “Surprise and Shine” event on September 9 will unveil the A20 Pro, the company’s first 2nm chipset for the iPhone, featuring new WMCM packaging technology instead of the older InFO_PoP solution.
- The A20 Pro is expected to debut in the iPhone 18 Pro, iPhone 18 Pro Max, and Apple’s first foldable iPhone Fold, with a CPU configuration unchanged from the A19 Pro, maintaining two performance and four efficiency cores.
- The chip will likely feature a 7-core GPU, an increase enabled by the new packaging, and an expanded L2 cache for efficiency cores from 6MB to 8MB, potentially boosting graphics and memory performance.
- WMCM packaging allows memory dies to be placed beside the SoC die, increasing the memory bus width to 96 bits while retaining LPDDR5X memory, which could enhance bandwidth without moving to more expensive LPDDR6.
- Details about the Neural Engine and ISP blocks remain unclear, with further information expected following Apple’s official event and subsequent benchmark releases.
