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iPhone 18 Pro Logic Board’s High-Resolution Images Show A20 Pro Occupying Larger Die Area With Next-Generation Packaging & Qualcomm 5G Modem
Wccftech • • technology
Key Points:
- High-resolution images of the iPhone 18 Pro and Pro Max logic boards reveal the A20 Pro chip featuring Wafer-Level Multi-Chip Module Packaging (WMCM) with DRAM relocated for better heat dissipation.
- The A20 Pro SoC reportedly includes a larger Neural Engine for enhanced on-device AI and is paired with 96-bit LPDDR6 RAM, promising improved bandwidth and power efficiency.
- Despite Apple’s typical delay in adopting new standards, the use of LPDDR6 memory could boost AI performance and battery life, though official confirmation is pending as images lack explicit LPDDR6 labeling.
- The new iPhones are expected to use Qualcomm’s Snapdragon X80 5G modem, with indications that Apple will continue integrating Qualcomm baseband chips, at least for the U.S. market.
- Apple is anticipated to unveil the iPhone 18 Pro, iPhone 18 Pro Max, and potentially the iPhone Fold at its September keynote event.
