Leaked A20 Pro Image Hints at iPhone 18 Pro Performance Gains

Key Points:

• An alleged image of the iPhone 18 Pro motherboard reveals the A20 Pro chip using TSMC's new Wafer-Level Multi-Chip Module (WMCM) packaging technology, which is expected to enhance performance by improving heat dissipation and reducing thermal coupling between the processor and DRAM.
• Unlike the traditional package-on-package (PoP) design, WMCM places the DRAM beside the processor, and the A20 Pro chip is said to feature LPDDR6 memory with a 96-bit memory bus for more energy-efficient bandwidth.
• The chip size is reportedly similar to the A19 Pro, but the Neural Processing Unit (NPU) is significantly larger, indicating a focus on improved AI performance.
• The A20 Pro chip is expected to be manufactured using TSMC's 2nm process (N2), offering up to 15% faster performance and 30% better efficiency, along with new super-high-performance metal-insulator-metal capacitors to enhance power stability and energy efficiency.
• The iPhone 18 Pro, foldable iPhone, and iPhone 18 Pro Max models are anticipated to launch in September with shared features including 12GB RAM, 48-megapixel rear cameras, and Apple's C2 modem.