Major Pixel 11 leak reveals specs, new cameras, Tensor G6, more

Key Points:

• A major leak reveals detailed specs of Google's Pixel 11 series, including the new Tensor G6 chipset featuring a 1+4+2 ARM C1 core configuration, PowerVR GPU, updated Titan M3 security chip, and a switch to MediaTek M90 modem, ending Google's use of Samsung Exynos modems.
• The Pixel 11 series will introduce new camera hardware, with the base Pixel 11 and Pixel 11 Pro Fold using a 50MP "chemosh" sensor, while Pixel 11 Pro and Pro XL models get new "bastet" and "barghest" sensors for main and telephoto cameras, marking a rare hardware update.
• The leak notes a 12GB RAM option for the Pixel 11 Pro Fold, down from the previous 16GB, possibly reflecting pricing adjustments due to the RAM market, and mentions the removal of the built-in temperature sensor on Pro models.
• Google's "Pixel Glow" feature, similar to Nothing’s Glyph, is expected to appear on the camera bar with LED lights, while the anticipated "Project Toscana" face unlock hardware will not debut with the Pixel 11 series.
• The Pixel 11 lineup is expected to launch in August with a design largely similar to the Pixel 10 series, continuing Google's flagship smartphone evolution.