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Qualcomm Is Copying Samsung Exynos 2600's Heat Path Block For Snapdragon 8 Elite Gen 6 Pro, But Has Botched The Implementation
Wccftech • • general
Key Points:
- Qualcomm is reportedly adopting Samsung's Heat Path Block (HPB) thermal technology in its upcoming Snapdragon 8 Elite Gen 6 Pro chip to address overheating issues, though the implementation is said to be less effective.
- Samsung's Exynos 2600 introduced the HPB, a copper-based heat sink in direct contact with the application processor, which has been praised for its innovative thermal management.
- The next-generation Exynos 2700 is expected to feature an improved thermal solution called Side-by-Side (SbS), stacking the AP and DRAM dies horizontally with a copper-based HPB on top.
- The Snapdragon 8 Elite Gen 6 Pro chip is anticipated to be costly, with estimates over $300, likely limiting its use to premium smartphones like the Galaxy S27 Ultra, while other models may use the standard or binned versions.
- Qualcomm has prepared two versions of the Snapdragon 8 Elite Gen 6 Pro for the Galaxy S27 series, contrary to earlier rumors of six versions.
