Samsung Exynos 2700's New Architecture Set to Extend Thermal Lead Over Snapdragon, Unlock A 30-40% Jump In Memory Bandwidth
Wccftech • • technology
Key Points:
- Samsung's upcoming Exynos 2700 chip will feature a novel side-by-side (SBS) architecture and a refined heat sink, aiming to significantly boost memory bandwidth and thermal stability compared to its predecessor, the Exynos 2600.
- The Exynos 2700 will utilize Samsung's SF2P process, an advanced 2nm Gate-All-Around (GAA) transistor technology, promising a 12% increase in performance and a 25% reduction in energy consumption over the previous SF2 node.
- Unlike the Exynos 2600's stacked RAM and SoC design, the Exynos 2700 will place RAM alongside the SoC using Fan-out Wafer Level Packaging (FOWLP), enabling 30-40% higher memory bandwidth and improved power efficiency through shorter interconnects.
- The improved heat sink design on the Exynos 2700 will cover both the SoC and RAM, enhancing thermal stability beyond the already superior performance of the Exynos 2600 compared to Qualcomm's Snapdragon 8 Elite Gen 5 chip.
- Samsung's architectural and process innovations in the Exynos 2700 are expected to further strengthen its lead in chip thermal management and real-world performance.
