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SK hynix, In Collaboration With SanDisk, Unveils The New High Bandwidth Flash (HBF) Standard, Helping To Resolve AI Inference Bottlenecks, Targeting Up To 3TB/s Bandwidth
Wccftech • • business
Key Points:
- SK hynix and SanDisk have introduced a new memory standard called High Bandwidth Flash (HBF) to bridge the performance gap between High Bandwidth Memory (HBM) and SSDs in AI accelerators.
- HBF combines stacked NAND flash dies, offering up to 512GB capacity and bandwidth ranging from 0.4TB/s to 3TB/s, positioning it between HBM and enterprise SSDs in terms of performance and capacity.
- The technology aims to complement HBM by storing large AI models, such as those with 500 billion parameters, which are not cost-effective to keep entirely in HBM.
- HBF supports the UCIe (Universal Chiplet Interconnect Express) standard, enabling flexible connections to various CPUs and GPUs to improve overall system efficiency.
- Meanwhile, Samsung is advancing its own AI storage solutions with high-layer NAND flash and collaborations with NVIDIA, setting the stage for competition between emerging memory standards in the AI sector.
