Snapdragon 8 Elite Extreme Gen 6’s Engineering Prototype Video Surfaces Before Official Launch, Showing A New Packaging, Improved Benchmark Scores & More

Key Points:

• A Chinese content creator leaked an engineering prototype video of Qualcomm’s Snapdragon 8 Elite Extreme Gen 6, revealing its specifications, advanced packaging, and Geekbench 6 benchmark scores ahead of the Snapdragon Summit.
• The Snapdragon 8 Elite Extreme Gen 6 features a new CPU cluster configuration of "2 + 3 + 3" with clock speeds up to 5.10GHz, enabled by TSMC’s 2nm “N2P” process and improved SoC packaging.
• In Geekbench 6 tests, the Snapdragon 8 Elite Extreme Gen 6 scored 4,327 single-core and 12,873 multi-core points, narrowly surpassing Apple’s A20 Pro in multi-core performance but trailing in single-core, where the A20 Pro scored 4,725 points.
• Qualcomm’s engineering prototype includes a Heat Pass Block heatsink similar to Samsung’s Exynos 2600 design to improve heat dissipation, though its DRAM placement remains on top, unlike Apple’s side placement in the A20 Pro.
• The Snapdragon Summit starting tomorrow is expected to provide official details and further insights into the Snapdragon 8 Elite Extreme Gen 6’s performance and design.