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Taiwan breaks ground on advanced packaging park anchored by TSMC
reuters.com • • business
Key Points:
- TSMC will construct two buildings at the Baipu Industrial Park in Kaohsiung, including a technology validation laboratory and a talent training center, with operations expected to start in late 2029.
- The Baipu Industrial Park will function as a testing and validation hub for equipment and materials used in TSMC's advanced packaging, crucial for producing AI chips.
- Taiwan President Lai Ching-te emphasized that the park will accelerate research and development, enabling faster mass production and helping local companies join the advanced chipmaking supply chain.
- The park spans approximately 88.7 hectares, with 53.6 hectares designated for industrial use, supporting Taiwan's goal to expand its semiconductor ecosystem in the south.
- The government has assessed Taiwan's electricity needs through 2035 and is confident in maintaining a stable power supply to support ongoing semiconductor industry growth.
