Top chipmakers embrace ASML’s $400M machines, agree to crucial chipmaking change

Key Points:

• Samsung Electronics and Taiwan Semiconductor Manufacturing Co. (TSMC) plan to adopt ASML’s latest high numerical aperture (high NA) EUV lithography machines within the next several years, aiming to produce more advanced and efficient chips for AI data centers and consumer electronics.
• Intel has already begun using high-NA EUV machines in manufacturing Panther Lake processors for mobile devices starting in July 2026, marking a significant industry shift toward this costly but more precise chipmaking technology.
• Samsung, TSMC, and Intel are collaborating with ASML to transition from 6-inch to 12-inch photomasks, a change expected to boost chip production efficiency on high NA EUV machines by 40 percent; SK Hynix is also considering joining this initiative.
• The adoption of high NA EUV technology is critical amid rising demand for AI-related chips and ongoing supply shortages impacting consumer electronics pricing, while geopolitical tensions limit ASML’s advanced machine exports to China.
• China faces significant challenges in developing indigenous EUV lithography technology due to complex supply chains and specialized components, with experts predicting it could take up to 15 years for China to catch up in this field.